Most MEMS applications are multiphysics by their very nature and usually include electromagnetic-structural, thermal-structural, fluid-structure (FSI), or electromagnetic-fluid interactions. The piezoelectric effect, for example, manifests itself as a transfer of electrical energy to mechanical energy and vice-versa, while film damping dissipates energy from moving structures to impose a damping effect.
lalaIn order to simulate the sensors, actuators, accelerometers and other components in microelectromechanical systems, strong coupling between the different phenomena is needed. Such Multiphysics Modeling is illustrated in the following links:
