Study of Tertiary Current Distributions on the Wafer in a Plating Cell

L. Tong[1]
[1]Keisoku Engineering System Co., Ltd,. Chiyoda-ku, Tokyo, Japan

The reciprocating paddle cell is a known practical method for depositing alloy films on wafer substrates. Recently, the mass transfer boundary layer within an industrial wafer plating cell was studied based on the measurement of limiting current. It was indicated that a shear-plate fluid agitation mechanism is capable of generating a thin (i.e.

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