Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Microfluidic Design of Neuron-MOSFET based on ISFET

A. Jain[1], and A. Garg[2]
[1]BITS Pilani, Goa, India
[2]Bhartiya Vidyapeeth College, New Delhi, India

In this paper we suggest a device which combines the operation of a neuron-MOS and an ISFET. An ISFET is an ion-sensitive field effect transistor used to measure ion concentrations in a solution; when the ion concentration changes, the current through the transistor changes accordingly. A voltage between substrate and the oxide surfaces arises due to an ions sheath. It contains a conventional ...

Reliability Testing for the Next Generation of Microelectronic Devices

J. Plawsky, W. Gill, M. Riley, J. Borja, and B. Williams
Rensselaer Polytechnic Institute, Troy, NY, USA

Understanding and predicting the reliability of new generations of high and low-k dielectrics is increasingly important for gate oxides and interlayer dielectrics as both films have become thinner and scaling of device operating voltages has not kept pace with the decrease in the size of the dielectrics. We have developed a series of COMSOL-based mass transfer-based models that have proven to ...

Numerical Simulation of Crystallinity Distribution Developed In the Extrusion of Thick Walled Polypropylene Pipe

R. D. Wilcox1, and J. Collier2
1Chemistry Department, Lincoln Memorial University, Harrogate, TN, USA
2Chemical Engineering Department, Florida State University, Tallahassee, FL, USA

In a numerical simulation for crystallinity distribution, a 36 cm diameter polypropylene pipe with 3.7 cm wall thickness consisting of 3 subdomains that include a die, cooling box, and take-off section was modeled in a 2D axisymmetric geometry using COMSOL Multiphysics.The generalized heat transfer module was used to solve for the temperature distribution in the flowing melt using conductive and ...

Electro-Thermal Analysis of a Contactor: Comparing the Performance of Two Braze Alloys during the Temperature Rise Test

E. Gutierrez-Miravete[1], and G. Contreras[2]
[1]Rensselaer at Hartford, Hartford, CT, USA
[2]General Electric Co., Plainville, CT, USA

The purpose of this study was to develop mathematical models of the coupled electro-thermal process in selected, typical contactors that could then be validated and verified by comparing model predictions with the results of previous studies and with experimental data obtained during a temperature rise test. The study employed Finite Element Analysis using COMSOL to simulate coupled ...

Numerical Modeling of Falling Aluminum Particle Oxidation in Air

A. Davidy
Israel Military Industry, Ramat-Hasharon, Israel

Because of its high enthalpy of combustion, aluminum has been added to energetic materials. In this paper, a two dimension thermal model is developed and assessed to describe the interrelated processes of Aluminum particle oxidation by using the software COMSOL Multiphysics. The thermal model consists of thermal radiation, forced convection and thermal conduction and oxygen diffusion. It is ...

CVD Graphene Growth Mechanism on Nickel Thin Films - new

K. Al-Shurman[1], H. Naseem[2]
[1]The Institute for Nanoscience & Engineering, University of Arkansas, Fayetteville, AR, USA
[2]Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA

Chemical vapor deposition is considered a promising method for synthesis of graphene films on different types of substrate utilizing transition metals such as Ni. However, synthesizing a single-layer graphene and controlling the quality of the graphene CVD film on Ni are very challenging due to the multiplicity of the CVD growth conditions. COMSOL Multiphysics® software is used to investigate ...

Expanding Your Materials Horizons

R. Pryor[1]
[1]Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA

Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and time ...

Ignition Process of Microplasmas

H. Porteanu, and R. Gesche
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Berlin, Germany

Microplasmas at atmospheric pressure are required in many applications, where treatments in normal ambient, with spatial resolution, are important. The interest on such miniaturized sources has increased due to the availability of a new generation of microwave sources based on high power GaN transistors. The present work deals with a simulation of the plasma formation after the application of the ...

Thermomagnetic Siphoning on a Bundle of Current-Carrying Wires

J.C. Boulware, and S. Jensen
Space Dynamics Laboratory, North Logan, UT, USA

Using COMSOL Multiphysics, studies were performed showing that thermomagnetic siphoning (TMS) is a sufficient manner of regulating the temperature of a bundle of current-carrying wires wrapped with a magnetorheological fluid (MRF) jacket. Because of Curie’s Law, the cooler MRF on the outside of the jacket is drawn towards the wires due to the induced magnetic field. The process continually ...

Exploiting New Features of COMSOL Version 4 on Conjugate Heat Transfer Problems

J.D. Freels[1], I.T. Bodey[2], and R.V. Arimilli[2]
[1]Oak Ridge National Laboratory, Oak Ridge, TN, USA
[2]University of Tennessee, Knoxville, TN, USA

Recent new releases of COMSOL provide the user with a dramatic new interface from which to interact, and many new features “under the hood” for solving problems more efficiently and with even greater accuracy and consistency than before. This paper will explore several of these new version 4+ features for the conjugate heat transfer class of problems. Our environment is unique in that we ...

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