Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Magnetic Nanoparticles for Novel Granular Spintronic Devices

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

Superparamagnetic nanoparticles have a wide range of applications in modern electric devices. Recent developments have identi fied them as components for a new type of magnetoresistance sensor. We propose a model for the numeric evaluation of the sensor properties. Based on the solutions of the Landau-Lifshitz-Gilbert equation for a set of homogeneously magnetized spheres arranged in highly ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Thermal Properties of Copper Tungsten with Copper Via Composite

J. Ma[1], A. Parker[1], and K. Kuan[2]
[1]Southeastern Louisiana University, Hammond, LA, USA
[2]Torrey Hill Technology LLC, SanDiego, CA, USA

This study focuses on a low-cost composite material based on CuW with Cu via, which functions as a more efficient thermal path for heat conduction. A 50mm X 50mm X 1mm CuW(15/85) speciman consists an array of 30X30 uniformly distributed cylindrical Cu via attaching to a microprocessor generating 100 watts power was studied. By calculating the heat flux coming out of the top and the ...

Making Cartograms and Using them for Data Acquisition

P. Mercure[1], and R. Haley[2]
[1]The Dow Chemical Company, Midland, MI
[2]ATM Research, Midland, MI

We demonstrate cartogram construction, where a geographical map is distorted to represent some measure, for example population, while trying to keep the shape of regions recognizable. We then apply this cartogram construction technique to optimize thermocouple locations. A heat generation and conduction model is used initialize the cartogram construction algorithm. A uniform distribution of ...

Design and Prototyping of a Passive Cold Chain Vaccine Storage Device for Long Hold Times

D. Gasperino [1], O. Yildirim[1]
[1]Intellectual Ventures, Bellevue, WA, USA

In 2010 an estimated 109 million infants were immunized against DTP, which serves as a good proxy for vaccinations in general. At the same time, however, approximately 19.3 million infants worldwide were not reached by routine DTP immunization services. Immunization rates tend to be lowest in areas where poor infrastructure and limited access to electricity can cause vaccine stock-outs and high ...

Conjugate Heat Transfer

J. Crompton[1], L. Gritter[1], S. Yushanov[1], K. Koppenhoefer[1]
[1]AltaSim Technologies, Columbus, OH, USA

Quenching from high temperature by fluid flow has been analyzed; when no phase transformation occurs heat transfer is a function of conduction and convection. Flow conditions may lead to turbulent flow that affects the heat dissipation over the surface. Analysis of heat transfer with phase transformation is more complex ue to the range of near-wall effects from film boiling, transition boiling, ...

Development of the Service Frame for SBS Tracker GEM and TENDIGEM Development

F. Noto[1], E. Cisbani[2], F. Librizzi[1], F. Mammoliti[3], C.M. Sutera[1]
[1]Istituto Nazionale Fisica Nucleare - Sezione di Catania, Catania, Italy; Dipartimento di Fisica ed Astronomia, Università di Catania, Catania, Italy
[2]Istituto Nazionale Fisica Nucleare - Sezione di Roma, Roma, Italy; Istituto Superiore di Sanità, Roma, Italy
[3]Istituto Nazionale Fisica Nucleare - Sezione di Catania, Catania, Italy; Dipartimento di Fisica ed Astronomia, Università di Catania, Catania, Italy

The Gas Electron Multiplier (GEM) technology has been proven to tolerate rate larger than 50 MHz/cm² without noticeable aging and to provide the sub-millimeter resolution on working chambers up to 45x45 cm² [1]. A new GEM tracker is under development for the upgrade of the SBS spectrometer in Hall A at Jefferson Lab. The chambers of the tracker have been designed in a modular way: each chamber ...

Thermal Adversity in Solid-State Lighting

T. Dreeben[1]
[1]OSRAM SYLVANIA, Beverly, MA, USA

COMSOL Multiphysics is used to simulate natural convection and its impact on peak operating temperatures of solid-sate lighting in thermally adverse conditions. PDE modes in the general form are used in conjunction with a thin-surface conduction formulation in the weak form. COMSOL is used to predict both temperatures and heat flows through numerous components of the configuration. Model ...

Establishing Absorbed Dose Thresholds for Nonlinearities in Water Calorimetry

R.E. Tosh[1], H. Chen-Mayer[1]
[1]National Institute of Standards and Technology, Gaithersburg, MD, USA

The technique of water calorimetry for primary-standard dosimetry of radiotherapy-level ionizing radiation is well established at national metrology institutes around the world, where such a direct realization of absorbed dose establishes the basis for calibrating instruments used for dosimetry in medical settings. The typical calorimeter system uses miniature thermistor beads to measure ...

Flow behaviour of phosphorus-deoxidised copper in plane-strain hot extrusion

Jin, L.Z.1, Ssemakula, H.2, Sandström, R.1
1 Department of Materials Science and Engineering, Royal Institute of Technology, Sweden
2 Department of Production Engineering, Royal Institute of Technology, Sweden

Flow behaviour of phosphorus-deoxidised copper in plane-strain hot extrusion with an insertion in the die has been studied through a finite-element model consisting of fluid dynamics and heat transfer approaches. The billet material is considered as rigid-visco-plastic and rate-sensitive. A dynamic viscosity, which is strain-rate and temperature dependent, has been integrated into the model. ...

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