Alexandra Foley | September 8, 2014
We recently created a new resource for all of you managers working in research and development and product engineering. The Manager’s Guide to “Productivity and Innovation Through Multiphysics Simulation” features several high-tech companies and how they used multiphysics simulation to improve design workflow, which brought their innovative products to market on time and within budget.
Bridget Cunningham | September 5, 2014
Since their arrival on the music scene in the 1930s, vinyl records became a staple in the recording industry. While their use decreased due to digital recording methods becoming more dominant over the last couple of decades, this older medium continues to be valued for its unique and rich sound. Let’s take a closer look at this method of analog recording.
Jennifer Segui | September 3, 2014
Billions of dollars are spent each year in the U.S. to repair corrosion damage. To help reduce the high cost of corrosion, engineers at the Naval Research Laboratory (NRL) in Washington, D.C. are using multiphysics simulation to gain a better understanding of the fundamental mechanism. A successful research outcome at NRL will establish the correlation between metal microstructure, corrosion, and mechanical strength. Material designers could then develop stronger, corrosion-resistant materials using this new information.
Lexi Carver | September 1, 2014
Plotting visual simulation results on a model geometry is a great way to unveil the sometimes-mysterious physics happening behind the scenes in a device. Like learning a language, knowing how to use postprocessing tools helps designers investigate and understand their designs and processes more fully. Surface, volume, and line plots are three of the most common plot types used in postprocessing, and are applicable to many simulations.
Alexandra Foley | August 28, 2014
How does thermal contact resistance affect heat transfer? As the sizes of electronic devices continue to decrease, effective heat management becomes even more important. Today, electronic packaging has transitioned from its original purpose of providing mechanical protection and interconnection to also serving as a means of heat dissipation to the outside environment. Using a model from the Model Gallery, we explore the role of thermal contact resistance on heat management in a simple electronic package and heat sink assembly.
Mranal Jain | August 26, 2014
Creating animations is an effective way to present and visualize simulation results. In COMSOL Multiphysics, this is fairly straightforward using the Player node for time-dependent or parameter sweep study types. But, can we animate how the solution changes along a direction in a 3D steady-state model? The answer is yes. Here, we will learn how to combine parallel slices to create an animation for a 3D steady-state example model, using a three-step process.
Fanny Littmarck | September 4, 2014
Laura Bowen | September 2, 2014
Micromechanical sensors are crucial to many standard commercial products in nanoelectronics and nanomechanics. These are sensors that are so small they operate on the nanoscale, with parts measuring in billionths of a meter. Researchers at the University of Alberta are exploring ways to find the effective mass — the mass of a particle when reacting to a force — of micromechanical sensors in a faster way. This measurement is key to performing thermomechanical calibration.
Bridget Cunningham | August 29, 2014
Bridget Cunningham | August 27, 2014
Alexandra Foley | August 25, 2014
Hematology analysis is an important step in medical diagnoses, often determining the treatment that a patient will receive. With a patient’s life on the line, it is vital that these analyses are accurate to the highest degree possible. Researchers at HORIBA Medical, a worldwide supplier of medical diagnostic equipment, turned to simulation to develop new methods for optimizing the accuracy of their hematology analysis devices. The resulting technique is currently used in some of their best-selling equipment.