Heating Circuit

Application ID: 465

Small heating circuits find use in many applications. For example, in manufacturing processes, they heat up reactive fluids. The device in this tutorial example consists of an electrically resistive layer deposited on a glass plate. The layer results in Joule heating when a voltage is applied to the circuit, which results in a structural deformation. The layer’s properties determine the amount of heat produced.

This multiphysics example simulates the electrical heat generation, heat transfer, and mechanical stresses and deformations of a heating circuit device. The model uses the Heat Transfer in Solids interface in combination with the Electric Currents, Shell interface and the Solid Mechanics and Membrane interfaces. The Rigid Motion Suppression condition is automatically applied to a set of suitable constraints based on the geometry model and physics interfaces.

This model example illustrates applications of this type that would nominally be built using the following products:

Heat Transfer Module Structural Mechanics Module