Application ID: 465
Small heating circuits find use in many applications. For example, in manufacturing processes they heat up reactive fluids. The device used consists of an electrically resistive layer deposited on a glass plate. The layer causes Joule heating when a voltage is applied to the circuit. The layer’s properties determine the amount of heat produced.
This multiphysics example simulates the electrical heat generation, the heat transfer, and the mechanical stresses and deformations of a heating circuit device. The model uses the Heat Transfer interface of the Heat Transfer module in combination with the Shell, Conductive Media DC interface from the AC/DC Module and the Solid, Stress-Strain and Shell interfaces from the Structural Mechanics Module.
This application was built using the following:Heat Transfer Module Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.