Laser Heating of a Silicon Wafer
Application ID: 13835
A silicon wafer is heated up by a laser that moves radially in and out over time. In addition, the wafer itself is rotated on its stage. The incident heat flux from the laser is modeled as a spatially distributed heat source on the surface. The transient thermal response of the wafer is shown. The peak, average, and minimum temperature during the heating process is computed, as well as the temperature variations across the wafer.
This model is included as an example in the following products:COMSOL Multiphysics®
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
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