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Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid environment, thus swelling and causing undesired strains, which can be as high as thermal strain. This model ...
This model illustrates the instability of a space arc frame under concentrated vertical loading. A small lateral load is applied to break the symmetry of the structure. Members in the frame are modeled using geometrically nonlinear beam elements. The results are compared with available literature data.