D. Groulx, F. Samara, P.H. Biwole
Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
Department of Mathematics and Interactions, University of Nice Sophia-Antipolis, Nice, France
Design of latent heat energy storage systems (LHESS) requires knowledge of heat transfer processes within them, as well as the phase change behavior of the phase change material (PCM) use. COMSOL Multiphysics can be used to model (LHESS). Natural convection plays a crucial role during the charging phase of the LHESS, and methods to incorporate this heat transfer mode within COMSOL simulation ...
J.S. Crompton, L.T. Gritter, S.Y. Yushanov, and K.C. Koppenhoefer
AltaSim Technologies LLC, Columbus, OH, USA
Analysis of burning candles is extremely complex; combustion produces a highly non-linear temperature profile through the flame in which local temperatures may exceed 1400 °C. Heat transfer includes radiation, conduction and convection components and the low melting point of the candle wax leads to a phase change that allows mass transport via capillary flow prior to combustion in the flame. ...
A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®
J. Cepeda, S. Birla, J. Subbiah, H. Thippareddi
Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA
Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...
Z. Zheng, R. Zhang
Corning Incorporated, Corning, NY, USA
Introduction: Glass relaxation occurs in a range of temperature during transition from equilibrium to super-cooled liquid. Viscoelastic material model can be applied to simulate glass behavior during the glass transition regime and to predict the glass deformation and stress evolution. Viscoelasticity is the property of materials that exhibit both viscous and elastic characteristics when ...
P. S. Rao, C. K. Chandra
Agricultural and Food Engineering Department, Indian Institute of Technology Kharagpur, West Bengal, India
High Pressure Processing (HPP) is a leading non-thermal food processing technology that is often cited as a major technological innovation in food preservation. Although it is very early to place this emerging technology among the list of breakthroughs in food processing, HPP has started to become a viable commercial alternative for pasteurisation of value added fruits, vegetables, meat, and ...
Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach - new
A. Lecoanet, D. G. Ivey, H. Henein
Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada
A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the simulation and Rosenthal’s solution, when the geometry of the domain and the source are changed, has been ...
A. Priarone, and S. Lazzari
DIPTEM-TEC, Università di Genova, Genova, Italia; Corresponding Author: firstname.lastname@example.org
DIENCA, Università di Bologna, Bologna, Italia
The effect of the infinite length approximation on evaluating the temperature of the surface of Borehole Heat Exchangers is determined by means of COMSOL Multiphysics. In detail, two 2D models of a BHE are compared: in the first model, the domain is represented by a cross-section of the geometry, while in the second model, it is represented by an axial-section of the geometry and, thus, the BHE ...
T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT
Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...
C. K. C. Arruda , A. A. Silveira , L. C. R. Vieira , F. C. Dart ,
 CEPEL, Rio de Janeiro, RJ, Brazil
High Voltage Direct Current transmission (HVDC) is a suitable alternative for long distance transmission. During the years, the use of this technology has been increasing, which is one of the several reasons to improve methodologies in HVDC grounding systems. Unlike the usual approach in AC, a HVDC grounding system is distinguished by its operating procedures, which is, when it is configured ...
University of Turku, Turku, FInland
An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the LED driver. The main target of the simulations was to resolve the junction temperatures of LEDs, the most ...