Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Multiphase Porous Media Model for Microwave Drying Spherical Potatoes - new

H. Zhu[1], T. Gulati[2], K. Huang[1], A.K. Datta[2]
[1]Sichuan University, Chengdu, Sichuan, China
[2]Cornell University, Ithaca, NY, USA

Mathematical description of microwave drying requires the solution of two different physics: electromagnetics in the microwave oven cavity and food material and, transport process (mass, momentum and heat transport) in the food material. Maxwell’s equations for electromagnetics were solved using the RF Module using the GMRES iterative solver with the GeometricMultigrid preconditioner. Mass, ...

Using COMSOL Multiphysics to Model Crust Development at the Surface of Whole Beef Meat Subjected to Hot Air Jet

J. Sicard [1], S. Portanguen [1], C. Chevarin [1], A. Kondjoyan [1]
[1] INRA Auvergne-Rhône-Alpes, Saint-Genès-Champanelle, FRANCE

Crust which develops at the surface of meat leads to reactions which affect food color, flavor and safety. Whole pieces of meat are only contaminated by microorganisms at their surface. Thus intense thermal treatment can inactivate pathogenic bacteria; however the associated high temperatures also lead to the formation of carcinogenic compounds. An experimental study of crust development at ...

Modeling of Shrinkage Behavior in Cement Paste Using Thermal-structural Interaction

T. Chen[1], and P.G. Ifju[1]
[1]University of Florida, Gainesville, Florida, USA

This paper describes using thermal structural interaction to model the shrinkage behavior in cement paste under drying. An inverse method of combining the finite element analysis and the least-squares method is implemented to fit experimentally determined shrinkage in order to obtain material propertiesfrom the complex geometry used in the tests. The finite element model is created in COMSOL ...

Design and Nuclear-Safety Related Simulations of Bare-Pellet Test Irradiations for the Production of Pu-238 in the High Flux Isotope Reactor Using COMSOL

J.D. Freels[1], P.K. Jain[1], R.W. Hobbs[1]
[1]Oak Ridge National Laboratory, Oak Ridge, TN, USA

The Oak Ridge National Laboratory (ORNL) is developing technology to re-establish the capability to produce plutonium-238 for the National Aeronautics and Space Administration (NASA) as a power source material for powering vehicles while in deep-space. The High Flux Isotope Reactor (HFIR) of ORNL has been utilized to perform test irradiations of in-capsulated neptunium oxide (NpO2) and aluminum ...

Improvement of a Steady State Method of Thermal Interface Material Characterization by Use of a Three Dimensional FEA Simulation in COMSOL

B. Sponagle[1], D. Groulx[1]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada

An FEA model of a steady state thermal interface material characterization apparatus was created in COMSOL Multiphysics 4.2a. This model was then fitted using three convection heat loss coefficients and the conductance of the TIM layer to a set of experimental measurements made using a steady state apparatus. It was shown that the model successfully matched the measured temperature values and ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Investigation of Mean-Flow Effects on Tubular Combustion Chamber Thermoacoustics Using a Burner Transfer Matrix Approach - new

A. Andreini[1], B. Facchini[1], A. Innocenti[1], D. Pampaloni[1]
[1]University of Florence, Florence, Italy

The paper presents a methodology to account for local mean-flow effects on thermo-acoustic instabilities to improve typical calculations performed under the zero-Mach number assumption. A 3D FEM model of a simplified combustor is solved with COMSOL Multiphysics® Pressure Acoustics interface. The Helmholtz equation is used to model the combustor and the classical k-τ model for the Flame Transfer ...

Study of Energy Transfer Mechanism for a Synchrotron X-ray Gas Absorber with COMSOL Multiphysics

A. Martín Ortega [1], Y. Dabin [1], T. Minea [2], A. Lacoste [3]
[1] ESRF, Grenoble, France
[2] LPGP, Université Paris-Sud XI, Orsay, France
[3] LPSC, Université Joseph Fourier, Grenoble, France

The high power of X-ray beam delivered by synchrotrons and free electron lasers, up to 240 W/mm2, requires heat load management solutions to obtain the best performance from the optical elements which will shape the beam for its use in the experimental stations [1]. One solution is the use of gas attenuators: a tube filled with an inert gas, usually Argon or Krypton, is placed between X-ray ...

A COMSOL Multiphysics® Software Interface with GEMS3K for Modeling Reactive Transport (Geo)Chemical Processes

O. B. Isgor [1], V. J. Azad [1],
[1] Oregon State University, Corvallis, OR, USA

This paper presents a generic interface for reactive transport process modeling that was developed between the COMSOL Multiphysics® software Java API (transport model) and GEMS3K (reaction model). While the transport of different species, kinetics of dissolution/precipitation, system potentials, fluid and gas flow, etc. can be modeled in a complex chemical system with COMSOL® software, the ...

Optimal Installation Configuration of Thermoelectric Generators

Y. Kaymak [1], F. Mintus [1],
[1] VDEh-Betriebsforschungsinstitut GmbH, Düsseldorf, Germany

This paper presents a multiphysics model to the convective, conductive and radiative heat transfer for the thermoelectric modules (TEMs), which are used to convert heat flux into electrical current. The model basically consists of heat transfer in solids, heat transfer in thin shells, surface-to-surface radiation and non-isothermal turbulent flow. The developed model has a good agreement with ...