Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Proof of Concept and Properties of Micro Hydraulic Displacement Amplifier

R. Zhu[1], A. Malisauskaite[1], U. Mescheder [1], U. Wallrabe[2]
[1]Hochschule Furtwangen University, Furtwangen, Baden-Württemberg,Germany
[2]Institut für Mikrosystemtechnik (IMTEK), Freiburg, Baden-Württemberg, Germany

Nowadays, mathematical models have been widely applied in varies fields; especially in fluid mechanics and nonlinear material which are very complex or even not possible to be calculated using analytical methods. In this paper, a hydraulic displacement amplifier coupled with fluid mechanics and hyperelastic material is studied through 2D axisymmetric FSI (Fluid-structure interaction) model in ...

Design and Simulation of MEMS-based Piezoelectric Accelerometer

Siram Sai Krishna[1], Nuti Venkata Subrahmanya Ayyappa Sai[1], Dr.K.Srinivasa Rao[2]
[1]Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India
[2]Professor & HOD, Dept. of Electronics and Instrumentation Engineering, Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India

The Micro electro mechanical systems (MEMS) technology provides us a platform to interface between mechanical and electrical components. In this paper, we have designed MEMS accelerometer based on piezoelectric property, and simulated using COMSOL Multiphysics®. The design, which has PZT kept in the annular diaphragm, provides good sensitivity. When this accelerometer is subjected to stress ...

Two-axis Analysis of Micromirror Using Electrothermal Actuators For Optical Switching Applications

B.Bharanipriyaa[1], V.S.Selvakumar[1], L. Sujatha[1]
[1] National MEMS Design Center, Rajalakshmi Engineering College, Thandalam, Chennai,Tamil Nadu, India

Micro Mirrors is a versatile device which has been gaining popularity and this finds application in fields such as optical switching, display and in medical fields for non-invasive imaging. A thermally actuated mirror moves in either positive or negative directions of x and y. The ends of thermal actuators are attached to the edges of the mirror. Thus when voltage is applied to the thermal ...

Support-Q Optimisation of a Trapped Mode Beam Resonator - new

T. H. Hanley[1], H. T. D. Grigg[1], B. J. Gallacher[1]
[1]Newcastle University, Newcastle-Upon-Tyne, UK

Introducing a disorder into a finite periodic oscillatory system induces the presence of a 'trapped mode': a mode in which the displacement field is localised to the region of the disorder. A main inhibitor to MEMS resonators achieving a high quality (Q) factor is energy radiation through the support to the substrate. The trapped modes present a way to tune this to a minimal value. An initial ...

The Simulation of Motion of a Slider upon a Stator Due to Frictional Force Using COMSOL Multiphysics® Software - new

H. B. Nemade[1]
[1]Indian Institute of Technology Guwahati, Guwahati, Assam, India

The Surface Acoustic Wave (SAW) linear motor was studied which is developed utilizing the friction principle for driving. The principle says that, when a slider is placed on the Rayleigh waves generated on a stator, the slider moves in reverse direction of the wave due to friction between the stator and the slider. A LiNbO3 piezoelectric substrate is used as a stator where comb structured Al ...

Optimization and Simulation of MEMS Based Thermal Sensor for Performance of Transformer Oil

V. Vijayalakshmi[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

In this work, a bimetallic strip based thermal sensor was designed using MEMS module of COMSOL Multiphysics® software to monitor the temperature rise in insulating oil which was used as coolant in transformers. The bimetallic strip was designed with different shapes such as cylindrical, rectangle, square & conical and different compositions such as Al/Steel Alloy and Fe/Cu which can withstand ...

Study of Pull-In Voltage in MEMS Actuators

P. D. Hanasi[1], B. G. Sheeparamatti[1], B. B. Kirankumar[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India

Micro cantilevers are the basic MEMS structures, which can be used both as sensors and actuators. The . The objective of this work is to study concept of pull-in voltage and how to reduce the same. Voltage is applied to upper cantilever beam and lower contact electrode is made as ground. By increasing common area between cantilever beam and contact electrode, and also by reducing thickness of ...

Low Cost All Optical Swept Source for Optical Communication Applications

J. T. Andrews[1], S. Chaurasiya[1], O. P. Chaudhary[1], D. Agarwal[1]
[1]National MEMS Design, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore Madhya Pradesh, India

By introducing a periodic modulation in a waveguide, it is possible to create an interaction between forward-traveling and backward-traveling modes of an optical waveguide. Bragg grating may be a one dimensional diffraction grating which diffracts light from the forward-traveling mode into the backward traveling mode. Since the Bragg grating reflects at the wavelength for which it is ...

Modelagem Computacional de Difusores para Microbombas

A. G. S. Barreto Neto [1], A. M. N. Lima [2], C. S. Moreira [1],
[1] Instituto Federal de Ciência e Tecnologia - IFPB, João Pessoa, PB, Brasil
[2] Universidade Federal de Campina Grande - UFCG, Campina Grande, PB, Brasil

Este trabalho trata do dimensionamento da estrutura bocal/difusor utilizando a simulação computacional com fronteira móvel. Esse tipo de simulação contempla toda estrutura da bomba, isto é, câmara de bombeamento, difusor e área de dispersão de fluxo, de modo a contabilizar o refluxo em função da estrutura, possibilitando um projeto mais realísticos da estrutura.

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...