Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Multiphysics Modeling of Implantable Micro-Electrode for Diagnostic and Therapeutic Applications in Neural Disorders

H. W. Ferose, R. G. Prasath, M. Alagappan, and G. Anju .
PSG College of Technology
Tamil Nadu, India

Neural disorders like epilepsy, Parkinson’s disease and Alzheimer’s disease have become a major area of concern because of their complexity and the huge number of occurrences. At present, most of the treatments are based on drugs and external nerve stimulation demanding critical care. This study aims at the design and simulation of an implantable micro-electrode which can lead to better ...

Wireless RF Digital System for Mouth-Embedded Multi-Sensor Communication

I.M. Abdel-Motaleb[1], J. Lavrencik [1]
[1]Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA

There is urgent need to monitor dental and oral diseases, such as tooth decay, gum diseases, and teeth grinding. Such monitoring can be achieved by embedding sensors in the mouth. This technique faces some difficulties. The first is how the power needed for the operation of the sensors and the associated electronic chips can be generated. This power can be generated using the pressure exerted by ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Janus 颗粒自驱运动的数值模拟

崔海航 [1], 王雷磊 [1], 谭晓君 [1],
[1] 西安建筑科技大学,西安,陕西,中国

Janus 颗粒是由物理或化学性质不同的两部分所构成的颗粒的总称。由于其结构的特殊性以及自驱动特性使其在MEMS、药物传输等领域有着潜在的应用价值。本文基于COMSOL Mutiphysics® 4.3a 多物理场耦合模拟平台对不同形状的 Pt-SiO2 型 Janus 颗粒的在不同浓度 H2O2 溶液中的自扩散泳动进行了数值模拟,并进一步研究模拟了球形 Janus 颗粒的近壁面运动。

FEM Analysis of MEMS Capacitive Presure Sensor with Segmented Boss Structure for Diaphragm

A. K. Ramesh [1], P. Ramesh [1],
[1]College of Engineering Munnar, Munnar, Kerala, India

Microelectromechanical system (MEMS) based capacitive pressure sensor designs with improved sensitivity is always a matter of great concern and the recent developments in such a design is the MEMS capacitive pressure sensor with bossed diaphragm.The bossed diaphragm model improves sensitivity but it compromises the range of operation which lead to a new design with the segmented boss structure. ...

Simulation of DC Current Sensor

K. Suresh, B.V.M.P.S. Kumar, U.V. Kumar, M. Umapathy, and G. Uma
National Institute of Technology Tiruchirapalli, Tamil Nadu, India

A proximity DC current sensor using of a piezo sensed and actuated cantilever beam with a permanent magnet mounted at its free end is designed and simulated in COMSOL Multiphysics. The change in resonant frequency of cantilever is a measure of the current through the wire. The sensor is found to be linear with good sensitivity.

COMSOL Multiphysics Applied to MEMS Simulation and Design

Dr. Piotr Kropelnicki[1]
Mu Xiao Jing[1]
Wan Chia Ang[1]
Cai Hong[1]
Andrew B. Randles[1]

[1]Institute of Microelectronics, Agency for Science, Technology and Research, Singapore, Singapore

In this research, we performed multiple COMSOL Multiphysics® simulations. We analyzed the dispersion curves of waves in a LAMB wave pressure sensor; simulated a thin metal film in a microbolometer and observed the resulting stress; investigated the thermal behavior of an acoustic wave microbolometer; and modeled the fluid-structure interaction (FSI) for piezoelectric-based energy harvesting from ...

Simulation of MEMS Based Pressure Sensor for Diagnosing Sleep Disorders

J. Vijitha[1], S. S. Priya[1], K. C. Devi[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

Sleep apnea is a type of sleep disorder characterized by pauses in breathing or instances of shallow or infrequent breathing during sleep. There is a need to diagnose sleep apnea since it leads to fluctuations in the oxygen level that in turn affect the heart rate and blood pressure. In order to detect this disorder, a Micro Electro Mechanical System (MEMS) based piezoelectric pressure sensor ...

Modeling of Vibrating Atomic Force Microscope´s Cantilever within Different Frames of Reference

E. Kamau, and F. Voigt
University of Oldenburg, Germany

Cantilever vibration modes were simulated with COMSOL Multiphysics. In the 1st approach the model consisted of an excitation piezo, a holder plate and a chip where the cantilever was mounted on. A sinusoidal voltage signal was applied to the piezo in the simulation, which resulted in movements of the holder plate and finally led to the excitation of the cantilever. In the 2nd approach the model ...

Modeling and Characterization of Superconducting MEMS for Microwave Applications in Radioastronomy

N. Al Cheikh[1], P. Xavier[1], J. Duchamp[1], and K. Schuster[2]
[1]Institute of Microelectronics, Electromagnetism and Photonics (IMEP-LAHC), Grenoble, France
[2]Institute of Millimetrics Radio Astronomy (IRAM), Grenoble, France

Superconducting GHz electronics circuits are frequently used in Radio Astronomy instrumentation. The features of these instrumentations can be significantly improved by using tuneable capacitances, which can be realized by electrically actuated, micromechanical bridges (MEMS) made of superconducting Niobium (Nb). In order to analyze the electromechanical behavior of such devices and the ...