Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Reliability Enhancement of Bio MEMS based Cantilever Array Sensors for Antigen Detection System using Heterogeneous Modular Redundancy

L. S. Sundharam[1]
[1]Kumaraguru college of Technology, Coimbatore, Tamil nadu, India

The objective of the work is to propose a reliability enhancement model for antigen detection system (ADS) using bio MEMS based cantilever array sensors using heterogeneous modular redundancy technique. The reliability of the ADS is expressed in terms of the constituent sub systems which are heterogeneous not only in their respective structures and behaviors but also in their forms. The possible ...

Multiphysics Modelling and Simulation of Implantable Wireless MEMS Capacitive Sensor for Cardiovascular Diagnostics

R.Yogeswari[1], S.Venkateshwaran [1], K.Umapathi[1]
[1]United Institute of Technology,Coimbatore,Tamil Nadu, India

Monitoring the Central aorta is a more effective way to diagnose cardiovascular diseases than conventional techniques. Approximately, six million people in the world are currently living with aortic aneurysm and every year 750,000 new cases are diagnosed. This paper presents the design and simulation of biocompatible Wireless MEMS sensor for detection of intraoperative leaks of the stent graph ...

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs - new

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero-dimensional (0D) structures have seen wide-ranging applications in laser diodes, solar cells and LEDs to name ...

FEM Study on Contactless Excitation of Acoustic Waves in SAWDevices

A. K. Namdeo[1], N. Ramakrishna[2], H. B. Nemade[1,2], and R. P. Palathinkal[1]

[1] Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, Assam, India
[2] Centre for Nanotechnology. Indian Institute of Technology Guwahati, Assam, India

In this paper a finite element method(FEM) study of a surface acoustic wave (SAW)device excited by electrostatic coupling method is performed by using COMSOL Multiphysics. We have modeled a Rayleigh wave type SAW device by choosing YZ Lithium niobate as the substrate. The effect of external radio frequency (RF) field to the SAW device is analyzed. The effect of distance between the contactless ...

Droplet Generation by Means of a Two-Fluid Probe

B.P. Cahill[1], M. Quade[1], G. Gastrock[1], K. Lemke[1], J. Metze[1], and D. Beckmann[1]

[1]Institut für Bioprozess und Analysenmesstechnik e.V., Rosenhof, Heilbad Heiligenstadt, Germany

This paper presents a simulation of the operation of a new type of droplet generation probe. This probe, consisting of two concentrically-arranged tubings, is immersed in a beaker of cell medium so that oil is pumped through the outer tubing at a pumping speed less than fluid is drawn into the inner tubing. In this way, droplets of cell medium are entrained into the outlet tubing forming a ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Design of an Electrodynamically Actuated Microvalve Using COMSOL Multiphysics® and MATLAB®

M. Williams, J. Zito, J. Agashe, A. Sopeju, and D. Arnold
University of Florida, Gainesville, USA

This paper describes the design of a normally closed, electrodynamic microvalve.  Magnetic forces between a permanent magnet in the valve cover and a soft magnet in the valve seat hold the valve closed.  The combination of electrodynamic actuation and a mechanical restoring spring are used to open the valve.  A device model and a design optimization strategy using COMSOL ...

Positioning System for Particles in Microfluidic Structures

D. Kappe[1], A. Hütten[1]
[1]University of Bielefeld, Bielefeld, Germany

The possibility to detect and probe molecules in microfluidic devices gives rise to interesting applications. There are different approaches how to detect and probe particles, but a common step, for most methods, is to place the particles on a sensor. This can be done by applying external field gradients, or in this case by utilizing gravitational and hydrodynamic effects. Therefore, the sensor ...

Finite Element Model of Surface Acoustic Wave Scattering with High-Aspect-Ratio Irregularities

S. Iuliia [1], Y. Sergey [1], K. Sergey [1], P. Alexey [1],
[1] Saratov State University, Saratov, Russia

The design of surface acoustic wave (SAW) devices needs the accurate study of the scattering fields, arising from the interaction of SAW with periodic irregularities placed on a surface of crystal to form interdigital transducers or reflective structures (RS). To solve this problem, the finite element methods are very perspective, because they allow to take into account the actual geometry of ...

Design and Simulation of Capacitive Pressure Sensor for Condition Monitoring

S. Sushma[1], R. Surekha[1], K. J. Rudhresha[1], S. Sahu [1], S. Singh4 [1], S. L. Pinjare6 [1],
[1] Dept. of ECE, Nitte Meenakshi Institute of Technology, Bangalore, Karnataka, India.

This poster focuses on the development of a capacitive pressure sensor for condition monitoring applications. One method to measure vibrations is to mount an pressure sensor on the vibrating machinery or object and measure the pressure exerted due to vibrations. Measured pressure level helps to detect any deviations from the normal conditions.