Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Analysis Of Linearly Polarized Modes

I. Avram, and I. Gavril Tarnovan
The Technical University of Cluj Napoca
Cluj, Romania

This paper presents a study on the propagation modes of electromagnetic waves through a step index fiber optics. To analyze the propagation of electromagnetic field, a simulation in Comsol 4.0 has been implemented using two different optical fibers. Obtaining the propagation modes, called linearly polarized modes (LPnm) to get their characterization according to the radial and azimuthal ...

Lamb Waves and Dispersion Curves in Plates and It’s Applications in NDE Experiences Using Comsol Multiphysics

P. Gómez, J. P. Fernandez, and P. D. García
Hydro-Geophysics & NDE Modeling Unit
University of Oviedo
Mieres, Spain

In this paper, a model for numerically obtaining lamb wave modes and dispersion curves in plates is presented. It is shown that COMSOL Multiphysics can be employed to simulate the behavior of guided waves in dispersive plates, which is useful for NDE applications. A two dimensional steel plate (4x0.1 meters) is excited with a space-time impact point source. To model the point source, we use ...

Simulation and Design of an Oven for PET Blow Molding Machines

M. Mor[1], C. Seneci[1], V. Zacché[1], C. Remino[1], G. Petrogalli[1], D. Fausti[1]
[1]Polibrixia, Brescia, Italy

This paper presents the study and design of a new generation oven for PET blow-molding machines. The design faced several technical challenges such as: the temperature distribution in the critical areas, the sharp curvature radius, the high PET thermal inertia and the presence of boundary elements, which affected the overall performances. The work included an analysis of the preform material ...

CVD Graphene Growth Mechanism on Nickel Thin Films - new

K. Al-Shurman[1], H. Naseem[2]
[1]The Institute for Nanoscience & Engineering, University of Arkansas, Fayetteville, AR, USA
[2]Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA

Chemical vapor deposition is considered a promising method for synthesis of graphene films on different types of substrate utilizing transition metals such as Ni. However, synthesizing a single-layer graphene and controlling the quality of the graphene CVD film on Ni are very challenging due to the multiplicity of the CVD growth conditions. COMSOL Multiphysics® software is used to investigate ...

Thermal Management of Li-ion Battery Packs - new

D. Adair[1], K. Ismailov[2], Z. Bakenov[3]
[1]School of Engineering, Nazarbayev University, Astana, Kazakhstan
[2]CPS, Nazarbayev University, Astana, Kazakhstan
[3]Institute of Batteries, Astana, Kazakhstan

A design for the thermal management of the media used for packing Li-ion batteries used in hybrid and electric vehicles has been developed. The design satisfies all thermal and physical issues relating to the battery packs used in vehicles such as operating temperature range and volume, and, should increase battery life cycle and charge and discharge performances. Particular attention was ...

Modeling of Ultrasonic Transducers and Ultrasonic Wave Propagation for Commercial Applications Using Finite Elements with Experimental Visualization of Waves for Validation - new

D. R. Andrews[1]
[1]Cambridge Ultrasonics, Over, UK

Finite element (FE) modelling of ultrasonic propagation using COMSOL Multiphysics® simulations can be used to create images of waves. Unfortunately, in time-stepping solutions, it is possible for numerical instabilities to grow large and dominate the solution adversely. Any design of transducer that is based upon poorly-configured FE models is unlikely to perform as expected and will almost ...

Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach - new

A. Lecoanet[1], D. G. Ivey[1], H. Henein[1]
[1]Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada

A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the simulation and Rosenthal’s solution, when the geometry of the domain and the source are changed, has been ...

Comparison Between Phase Field and ALE Methods to Model the Keyhole Digging During Spot Laser Welding

V. Bruyere[1], C. Touvrey[1], P. Namy[2]
[1]CEA-DAM, Is-sur-Tille, France
[2]SIMTEC, Grenoble, France

Nowadays, spot laser welding is a full-fledged part of industrial manufacturing and is routinely used due to its advantages. It generates very located temperature gradients, and therefore, induces small distortions in the pieces. The COMSOL Multiphysics® software is used to model the interaction stage of an isolated impact made with a Nd:YAG pulsed laser. The free surface evolution has been ...

Simulation of Passive Magnetic Bearing Using COMSOL Multiphysics

K. Falkowski
Military University of Technology
Warsaw, Poland

The article presents the process of verification of the passive magnetic bearing by the Comsol Multiphysic program. There is shown construction of the radial passive magnetic bearing PMB60x85x20-5, which was designed in the Military University of Technology. The distribution of the magnetic flux density and the static characteristic of the bearing were estimated by the Comsol Multiphysic. The ...

High Curvature Bending of Ultra-Thin Chips and Chip-on-Foil Assemblies

D. van den Ende[1]
[1]Holst Centre / TNO, Eindhoven, The Netherlands

Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with highly flexible electronics. This combination allows for highly intelligent products of unprecedented thinness, flexibility and cost. Examples include sensor systems integrated into food packaging or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile ...