See How Multiphysics Simulation Is Used in Research and Development


Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2018 Collection

Heat and Mass Transfer in Partially Frozen Food Material

B. Watzke[1], H. Deyber[1], and H. Limbach[2]
[1]Nestlé Research Centre, Lausanne, Switzerland
[2]Research Centre, Lausanne, Switzerland

The freezing curve of the food material was extracted from Differential Scanning Calorimetry experiments. A heat conductive model was generated in COMSOL, including the thermo-physical characteristics and the phase transition behavior. The resulting temperature-time evolutions at ... Read More

Using The Time Parameter As The Third Geometrical Dimension

J. Krah
AkerSolutions, Fornebu, Norway

The paper demonstrates that for some models a 2D geometry in Cartesian coordinates can be used to obtain a 3D solution with changes in z-direction. A heat exchanger serves as an example of a practical application. The required flow rate in a straight cooling pipe penetrating ... Read More

Reliability Testing for the Next Generation of Microelectronic Devices

J. Plawsky, W. Gill, M. Riley, J. Borja, and B. Williams
Rensselaer Polytechnic Institute, Troy, NY, USA

Understanding and predicting the reliability of new generations of high and low-k dielectrics is increasingly important for gate oxides and interlayer dielectrics as both films have become thinner and scaling of device operating voltages has not kept pace with the decrease in the size of ... Read More

Thermal Printing on Composite Media

W.T. Vetterling
ZINK Imaging, Bedford, MA, USA

In direct thermal printing, media is exposed to heat pulses from a print head carrying a linear array of resistive heaters. In this study we investigate the degree to which a thin substrate can be combined with a more compressible sub-layer to provide a composite structure that will hug ... Read More

Microsoft Technical Computing - The Advancement of Parallelism

T. Quinn
Microsoft, USA

Tom Quinn works as a Partner Business Development Manager for Microsoft as part of its HPC team working together with ISV, OEM and SI partners, in the HPC marketplace. Before joining Microsoft, Mr. Quinn worked as the Director of Government Business Development for Linux Networx, a ... Read More

Interpretation of Measurements with Novel Thermal Conductivity Sensors Suitable for Space Applications

N. I. Kömle[1], G. Kargl[1], E. Kaufmann[2], J. Knollenberg[2], and W. Macher[1]
[1]Space Research Institute, Austrian Academy of Sciences, Graz, Austria
[2]DLR Institut für Planetenforschung, Berlin, Germany

Thermal conductivity of near surface soil layers is a key parameter for understanding the energy balance of planetary bodies. To measure this property, heated needle sensors are frequently used in field and laboratory applications. To adapt this type of sensors for application on space ... Read More

Improving Fuel Usage in Microchannel Based Fuel Cells

P. Fodor, and J. D'Alessandro
Dept. of Physics
Cleveland State University
Cleveland, OH

In this work a miniaturized fuel cell design based on microchannels, into which the liquid fuel and oxidizer streams are fed through T shaped connectors, is optimized for improved fuel usage. This particular design exploits the laminar nature of the fluid flow at small Reynolds numbers ... Read More

Comparison of Borehole Heat Exchangers (BHEs): State of the Art vs. Novel Design Approaches

P. Oberdorfer, F. Maier, and E. Holzbecher
Applied Geology
Geoscience Centre
Georg-August-University Göttingen
Göttingen, Germany

The efficiency of borehole heat exchangers (BHEs) for geothermal purposes depends not only on material properties but also on their geometrical design. These days most used design consists of two parallel arranged U-shaped pipes which are embedded in a high-conductive shell filling out ... Read More

Design and Development of Microsystems within a Corporate Research Environment by Utilizing Comsol Multiphysics

A. Frey
Siemens AG
Corporate Research & Technologies
Munich, Germany

Alexander Frey received his M.A. degree from the University of Texas, Austin, in 1994, the Dipl. Phys. degree from the University of Wuerzburg, Germany in 1997 and the PhD from the Saarland University, Germany in 2010. In 1997 he joined Research Laboratories of Siemens working on the ... Read More

Coupling of Wired PCB With Microwave Radiation – 3D Simulation and Experimental Valuation

T. D. Bui[1], F. Bremerkamp[2], and M. Nowottnick[2]
[1]Department of Automobile Engineering, Thanh Do University, Ha Noi, Vietnam
[2]Institute of Electronic Appliances and Circuits, Department “Reliability and Safety of Electronic Systems”, University of Rostock, Rostock, Germany

Modern electronic assemblies and printed circuit boards (PCB) with their sensitive structures and elements have to be protected against environmental influences by conformal coating or casting compounds. In this case the main challenge is the simultaneous curing of the polymers and the ... Read More