A. Arevalo, E. Rawashdeh, I. G. Foulds
Computer, Electrical & Mathematical Sciences & Engineering Division (CEMSE), King Abdullah University of Science & Technology, Thuwal, Saudi Arabia
School of Engineering, University of British Columbia - Okanagan, Vancouver, BC, Canada
This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our ...
Micromechanical Design of Novel Thermal Composites for Temperature Dependent Thermal Conductivity - new
R. C. Thiagarajan,
ATOA Scientific Technologies Pvt. Ltd., Bengaluru, Karnataka, India
Materials with an order variable in thermal conductivity as a function of temperature are desirable for thermoelectric heat energy recovery, building thermal insulation and solar thermal applications. Thermal Conductivity is an inherent material property. Engineering the fundamental thermal conductivity needs manipulation at thermal photon level for conventional materials. Engineering thermal ...
L. Martinelli, A. Spiandorello, P. Ruol, and A. Lamberti
DICAM, Università di Bologna, Italy
Civil Engineer, Italy
IMAGE, Università di Padova, Italy
This paper will present a numerical model based on COMSOL Multiphysics suited to simulate the dynamic response of a catenary mooring (or a submarine cable). In general, mooring lines are subject to a direct wave load (e.g. drag, inertia) in addition to the movement of the vessel to which they are linked. Tests were carried out at the wave flume of the Maritime Laboratory of IMAGE Department, ...
J. Gaillard, D. Locatelli, S. Mulani, and R. Kapania
Microelectronics and Micromechanics Department, Engineering school of ENSICAEN (Ecole National Superieure d'Ingénieurs de Caen), Caen, France
 Engineering Science and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
 Aerospace and Ocean Engineering Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
The residual stresses developed in a stiffened panel manufactured using Electron Beam Freeform Fabrication (EBF3) process were studied. EBF3 process is a layer additive process that can be used to build near-net shaped parts directly using computer controlled techniques, which can be used for aerospace structures. A COMSOL model was created to simulate the residual stresses using a thermo ...
Kurt Lund Consulting, Del Mar, CA , USA
The present work formulates the dynamics of a slender structure as a long beam. This results in a PDE that is fourth-order in space, and second order in time. In COMSOL the coupling method is used to decompose this problem into two second-order equations, one for displacements, and one for bending moments, which are then solved to obtain frequencies and mode shapes. For verification of ...
B. Reine, J. Di-Tomaso, G. Dusserre, P. Olivier
Université de Toulouse, UPS, INSA, Mines Albi, ISAE, ICA, IUT, Dept. GMP, Toulouse Cedex, France
RESCOLL - Société de Recherche, Pessac Cedex, France
This paper addresses the study of thermal behavior of thermoset polymer matrix filled with microparticles. A numerical model was developed with COMSOL Multiphysics to get a random spatial distribution of fillers in a representative volume element (RVE). This model was then compared to an analytical reference model (Hamilton model) and experimental results. This comparison highlights a good ...
Boopathi S, Ms.E.Malar, Deepan Chakravarthi P
Department of Biomedical Engineering, PSG College of Technology, Coimbatore, Tamil Nadu, India
This paper deals with an integrated numerical and experimental analysis work aiming at the investigation of the thermal stress on nanowires in electronic gadgets especially computers and mobile phones. The comparative study of the nanowires are analyzed through the Thermal Stress physics using different variants such as Cu, Al, ZnO, Si(c), SiO2 which can be used in sensors, solar cells, LCD, ...
D. Jauffrès , J. M. Dedulle , D. Chaussende , K. Ariyawong 
 Univ. Grenoble Alpes, LMGP, SIMAP, CNRS, Grenoble, France
 Univ. Grenoble Alpes, LMGP, CNRS, Grenoble, France
During Physical Vapor Transport (PVT) growth of single 4H-SiC crystal and subsequent cooling down, thermal stresses lead to the multiplication of dislocations that are non-desirable for the semiconductor applications of this material. These dislocations induced by thermal stresses could be reduced by an appropriate control of the thermal gradients inside du crystal during its growth and cooling ...
M. Morrone ,
 CERN, Geneva, Switzerland
The high luminosity large hadron collider (HL-LHC) project aims at increasing the integrated luminosity by a factor of 10 from its original value (from 300 to 3000 fb-1) leading to the potential extension of scientific discoveries. To attain this goal, important upgrades will take place in the LHC by 2024 including the installation of new superconducting magnets in which new beam screens will be ...
F. Noto, M. Piscopo, L. Celona, D. Cittadino, S. Gammino, G. Cuttone, G. Gallo, G. Schillaci, C. Campisano, L. Lo Nigro, G. Costa, A. Campisano
Laboratorio Nazionale del Sud, Santa Sofia, Catania, Italy
Gravina di Catania, Sicily, Italy
Trinacria, Canalicchio, Catania, Italy
Unico Informatica, li Battiati, Catania, Italy
Different facilities for hadrontherapy have been built in the recent past. AISHa ion source has been designed by keeping in mind the typical requirements of hospital-based facilities, where the minimization of the mean time between failures (MTBF) is a key point together with the maintenance operations which should be fast and easy. The study of some critical parts of the facilities: the ...